Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite

Aiming at developing high thermal conductivity copper/diamond composite, an unconventional approach applying self-assembled monolayer (SAM) prior to the high-temperature sintering of composite was utilized enhance boundary conductance (TBC) between copper and diamond. The enhancement first systematically confirmed on a model interface system by detailed SAM morphology characterization TBC measurements. significantly depends coverage ordering, formation high-quality promoted 73 MW/m2-K from 27 MW/m2-K, value without SAM. With help molecular dynamics simulations, identified be determined number bridges overlap vibrational density states. diamond particles 210 μm in size were simultaneously functionalized with condition giving highest sintered together fabricate isotropic 50% volume fraction. measured marked 711 W/m-K room temperature, among ones similar diamond-particles fraction size. This work demonstrates novel strategy materials functionalization.